單晶硅超精密加工技術(shù)仿真

目 錄
前 言
第1章 緒論.......................................................................................................................................1
1.1　單晶硅超精密切削加工的發(fā)展現(xiàn)狀.......................................................................................2
1.1.1　單晶硅脆塑性轉(zhuǎn)變機(jī)理研究的國(guó)內(nèi)外現(xiàn)狀....................................................................2
1.1.2　金剛石刀具的超精密加工現(xiàn)狀........................................................................................4
1.2　切削的有限元仿真發(fā)展現(xiàn)狀...................................................................................................6
1.2.1　有限元軟件的選擇和簡(jiǎn)介................................................................................................6
1.2.2　有限元超精密切削的仿真研究現(xiàn)狀................................................................................7
1.3　單晶硅超精密切削的分子動(dòng)力學(xué)仿真發(fā)展現(xiàn)狀...................................................................9
第2章 超精密切削有限元理論研究及模型建立...............................................................12
2.1　切削的基本理論.....................................................................................................................12
2.1.1　切削變形區(qū)......................................................................................................................12
2.1.2　超精密切削機(jī)理及最小切削深度..................................................................................13
2.2　有限元法的概述.....................................................................................................................16
2.3　非線性有限元基礎(chǔ)與求解方法.............................................................................................17
2.3.1　非線性問題的分類..........................................................................................................17
2.3.2　非線性有限元的求解方法及迭代的收斂判據(jù)..............................................................21
2.4　Marc超精密切削的有限元建模............................................................................................23
2.4.1　建立超精密切削的幾何模型..........................................................................................24
2.4.2　建立刀具和工件的材料模型..........................................................................................24
2.4.3　建立接觸摩擦模型..........................................................................................................25
2.4.4　邊界條件的定義..............................................................................................................27
2.4.5　建立切屑的分離模型......................................................................................................27
2.4.6　熱機(jī)耦合..........................................................................................................................29
2.5　本章小結(jié).................................................................................................................................30
第3章 單晶硅二維精密切削過(guò)程的有限元仿真和結(jié)果分析.......................................31
3.1　切屑形狀的研究.....................................................................................................................31
3.1.1　切屑形成機(jī)理的研究......................................................................................................31
3.1.2　刀具幾何參數(shù)對(duì)切屑形狀的影響..................................................................................32
3.1.3　切削參數(shù)對(duì)切屑形狀的影響..........................................................................................34
3.2　單晶硅精密切削中切削力的研究.........................................................................................35
3.2.1　切削力隨時(shí)間的變化規(guī)律..............................................................................................35
3.2.2　刀具幾何參數(shù)對(duì)切削力的影響......................................................................................37
3.2.3　切削參數(shù)對(duì)切削力的影響..............................................................................................38
3.3　單晶硅精密切削中的應(yīng)力場(chǎng)分析.........................................................................................38
3.3.1　單晶硅應(yīng)力場(chǎng)的分布......................................................................................................38
3.3.2　刀具幾何參數(shù)對(duì)應(yīng)力的影響..........................................................................................39
3.3.3　切削參數(shù)對(duì)應(yīng)力的影響..................................................................................................41
3.4　單晶硅精密切削中的溫度場(chǎng)分析.........................................................................................43
3.4.1　單晶硅超精密切削的切削溫度場(chǎng)..................................................................................43
3.4.2　刀具幾何參數(shù)對(duì)切削溫度的影響..................................................................................45
3.4.3　切削參數(shù)對(duì)切削溫度最大值的影響..............................................................................46
3.5　本章小結(jié).................................................................................................................................47
第4章 單晶硅超精密切削實(shí)驗(yàn)及有限元模型的驗(yàn)證.....................................................48
4.1　超精密切削系統(tǒng)的建立.........................................................................................................48
4.1.1　超精密加工系統(tǒng)組成......................................................................................................48
4.1.2　超精密加工系統(tǒng)原理......................................................................................................50
4.2　超精密切削的實(shí)驗(yàn)研究.........................................................................................................50
4.3　本章小結(jié).................................................................................................................................53
第5章 單晶硅納米加工的三維仿真......................................................................................54
5.1　三維有限元建模.....................................................................................................................54
5.2　單晶硅晶面的選擇.................................................................................................................57
5.3　單晶硅微納結(jié)構(gòu)的加工.........................................................................................................60
5.4　本章小結(jié).................................................................................................................................63
第6章 單晶硅超精密切削的分子動(dòng)力學(xué)建模...................................................................64
6.1　分子動(dòng)力學(xué)仿真方法.............................................................................................................64
6.1.1　分子動(dòng)力學(xué)仿真的基本思想和理論..............................................................................64
6.1.2　周期性邊界條件..............................................................................................................65
6.1.3　分子動(dòng)力學(xué)系統(tǒng)的運(yùn)動(dòng)方程..........................................................................................67
6.1.4　積分算法與勢(shì)函數(shù)..........................................................................................................68
6.1.5　系綜概念..........................................................................................................................71
6.1.6　時(shí)間步長(zhǎng)..........................................................................................................................73
6.2　分子動(dòng)力學(xué)仿真步驟.............................................................................................................74
6.3　仿真模型的建立.....................................................................................................................76
6.4　本章小結(jié).................................................................................................................................77
第7章 硅表面超精密切削的分子動(dòng)力學(xué)仿真與分析.....................................................78
7.1　單晶硅切削過(guò)程的仿真.........................................................................................................78
7.1.1　仿真模擬參數(shù)設(shè)定..........................................................................................................78
7.1.2　弛豫分析..........................................................................................................................79
7.2　切削物理參數(shù)分析.................................................................................................................80
7.2.1　原子間勢(shì)能分析..............................................................................................................80
7.2.2　切削力分析......................................................................................................................81
7.3　單晶硅納米切削機(jī)理分析.....................................................................................................83
7.4　本章小結(jié).................................................................................................................................84
第8章 加工參數(shù)對(duì)硅表面切削過(guò)程的影響........................................................................85
8.1　切削深度對(duì)仿真結(jié)果的影響.................................................................................................85
8.2　切削速度對(duì)仿真結(jié)果的影響.................................................................................................87
8.3　刀具前角對(duì)仿真結(jié)果的影響.................................................................................................89
8.4　刀尖形狀對(duì)仿真結(jié)果的影響.................................................................................................92
8.5　本章小結(jié).................................................................................................................................94
參考文獻(xiàn)............................................................................................................................................95